According to Wuxi High-tech Zone Online report, at present, the overall progress of the civil engineering of the first phase of the core capacity construction project of China Resources Shanghai 8-inch wafer line is nearly 80% complete, the expansion plant is in the early preparation for mechanical and electrical installation, the clean room transformation project of the existing plant is in the final stage, and more than 50 equipment has been moved in and installed. It is expected that the first phase of the project plant construction will be completed by the end of this year.


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In 2004, China Resources Shanghai set up a new 6-inch and 8-inch IC chip manufacturing production line in Wuxi National High-tech Industrial Development Zone.

In 2008, due to changes in the market situation, China Resources Shanghai increased its investment. The original production lines of 60,000 6-inch 0.35-0.6 micron IC chips per month and 10,000 8-inch 0.25-0.35 micron IC chips per month will be adjusted to the construction of an 8-inch 0.25-micron IC chip production line of 60,000 chips per month.

It is reported that the project is implemented in two stages, of which the first stage of 30,000 pieces/month production line was completed by the Ministry of Environmental Protection in 2010, and the second stage of 30,000 pieces/month production line was completed in 2016, and completed the completion of environmental protection acceptance that year.

In 2019, in order to meet the needs of technological progress of China's IC design companies and promote the development of China's IC industry, China Resources Shanghai plans to expand the "annual output of 360,000 semiconductor components (8-inch line core capacity construction) project" on the basis of the existing 8-inch wafer production line, with a total investment of about 4 billion yuan.

According to the environmental impact report of the construction project previously announced by China Resources Microelectronics, the main project is constructed in two stages: the first stage annual output of 192,000 semiconductor components (16,000 pieces/month), the product categories are CMOS devices, DMOS devices, BCD devices, IGBT devices four categories. It is scheduled to be completed and put into operation by the end of 2020.

In the second stage, the annual output of semiconductor components is 168,000 pieces (14,000 pieces/month), of which 132,000 pieces (11,000 pieces/month) products are consistent with the first stage, and the other 36,000 pieces (0.3 thousand pieces/month) are new generation IGBT products, which have several existing product functions. It has the characteristics of high input impedance, low on-voltage, low drive power and low saturation voltage, etc. It is the core device of energy conversion and transmission, commonly known as the CPU of power electronic devices. It is scheduled to be completed and put into operation by the end of 2023.